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US Patent Issued to HEWLETT-PACKARD DEVELOPMENT on April 21 for "Printing at locations based on grid maps" (Spanish Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,927, issued on April 21, was assigned to HEWLETT-PACKARD DEVELOPMENT COMPANY LP (Spring, Texas). "Printing at locations based on grid maps... और पढ़ें


US Patent Issued to SCREEN Holdings, KYOCERA on April 21 for "Inkjet head" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,928, issued on April 21, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan) and KYOCERA Corp. (Kyoto, Japan). "Inkjet head" was inven... और पढ़ें


US Patent Issued to RISO Technologies on April 21 for "Liquid ejection head" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,929, issued on April 21, was assigned to RISO Technologies Corp. (Tokyo). "Liquid ejection head" was invented by Takashi Tozuka (Sunto Shi... और पढ़ें


US Patent Issued to SEIKO EPSON on April 21 for "Head chip and liquid ejecting head" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,930, issued on April 21, was assigned to SEIKO EPSON Corp. (Japan). "Head chip and liquid ejecting head" was invented by Haruki Kobayashi ... और पढ़ें


US Patent Issued to Canon on April 21 for "Liquid discharging apparatus and method for manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,931, issued on April 21, was assigned to Canon K.K. (Tokyo). "Liquid discharging apparatus and method for manufacturing the same" was inve... और पढ़ें


US Patent Issued to SEIKO EPSON on April 21 for "Liquid discharge head, liquid discharge apparatus, and nozzle substrate" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,932, issued on April 21, was assigned to SEIKO EPSON Corp. (Japan). "Liquid discharge head, liquid discharge apparatus, and nozzle substra... और पढ़ें


US Patent Issued to Canon on April 21 for "Method for manufacturing substrate bonded body and method for manufacturing liquid ejection substrate" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,933, issued on April 21, was assigned to Canon K.K. (Tokyo). "Method for manufacturing substrate bonded body and method for manufacturing ... और पढ़ें


US Patent Issued to Canon on April 21 for "Method of manufacturing liquid discharging head and liquid discharging head" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,934, issued on April 21, was assigned to Canon K.K. (Tokyo). "Method of manufacturing liquid discharging head and liquid discharging head"... और पढ़ें


US Patent Issued to Seiko Epson on April 21 for "Liquid discharge apparatus" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,935, issued on April 21, was assigned to Seiko Epson Corp. (Tokyo). "Liquid discharge apparatus" was invented by Hiroyuki Nakamura (Shioji... और पढ़ें


US Patent Issued to SEIKO EPSON on April 21 for "Liquid ejecting device" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,936, issued on April 21, was assigned to SEIKO EPSON Corp. (Tokyo). "Liquid ejecting device" was invented by Keigo Iizawa (Shiojiri, Japan... और पढ़ें